发明名称 |
Use of surface coupling agent to improve adhesion |
摘要 |
Disclosed are methods of processing a semiconductor structure, involving the steps of depositing a light-degradable surface coupling agent on a semiconductor substrate; depositing a resist over the light-degradable surface coupling agent; irradiating portions of the resist, wherein the light-degradable surface coupling agent under the irradiated portions of the resist at least partially decomposes; and developing the resist.
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申请公布号 |
US6746822(B1) |
申请公布日期 |
2004.06.08 |
申请号 |
US20020050484 |
申请日期 |
2002.01.16 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
RANGARAJAN BHARATH;TEMPLETON MICHAEL K.;SINGH BHANWAR |
分类号 |
G03F7/26;H01L21/027;H01L21/311;H01L21/3213;(IPC1-7):G03F7/20;G03F7/30 |
主分类号 |
G03F7/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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