发明名称 Thermal equalizing system for injection molding apparatus
摘要 Methods and apparatus for implementing a thermal equalizing system for use within a hot runner system of a plastic injection molding apparatus are described. The thermal equalizing system employs at least one thermal fluid circulating circuit which uses a heat transfer fluid to remove excess heat from overheated areas within the injection molding apparatus and/or to add heat to under heated areas within the injection molding apparatus.
申请公布号 US6746231(B1) 申请公布日期 2004.06.08
申请号 US20020222458 申请日期 2002.08.17
申请人 BENENATI SALVATORE 发明人 BENENATI SALVATORE
分类号 B29C45/27;(IPC1-7):B29C45/72 主分类号 B29C45/27
代理机构 代理人
主权项
地址