发明名称 |
METHOD FOR FORMING CAPACITOR OF SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method for forming a capacitor of a semiconductor device is provided to form a capacitor with sufficient capacitance for a stable operation of a device in response to high integration of a semiconductor device by using a single composite layer of Ta2O5(X)Y2O3(1-X) as a dielectric layer. CONSTITUTION: An interlayer dielectric(3) is formed on a semiconductor substrate(1) with bitlines(2). A contact plug(6) in contact with the substrate is formed in the interlayer dielectric. A storage node(10) is formed on the interlayer dielectric to contact the contact plug. A dielectric layer(11) made of a single composite layer of Ta2O5(X)Y2O3(1-X) is formed on the storage node by an ALD(atomic layer deposition) method. A diffusion preventing layer(12) is deposited on the dielectric layer. A plate electrode(13) is formed on the diffusion preventing layer.
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申请公布号 |
KR20040051701(A) |
申请公布日期 |
2004.06.19 |
申请号 |
KR20020078659 |
申请日期 |
2002.12.11 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
AHN, BYEONG GWON;PARK, SEONG HUN |
分类号 |
H01L27/04;H01L21/02;H01L21/314;H01L21/316;H01L21/8242;(IPC1-7):H01L27/04 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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