| 发明名称 |
POLISHING COMPOSITION |
| 摘要 |
Provided is a polishing composition which exhibits favorable storage stability and polishes a polishing object poor in chemical reactivity at a high speed.;The invention is a polishing composition which contains silica having an organic acid immobilized on a surface thereof, a dihydric alcohol having a molecular weight of less than 20,000 and a pH adjusting agent, the polishing composition having a pH of 6 or less. |
| 申请公布号 |
US2016293436(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201314442525 |
申请日期 |
2013.10.25 |
| 申请人 |
FUJIMI INCORPORATED |
发明人 |
YOKOTA Shuugo;SAKABE Koichi |
| 分类号 |
H01L21/3105;C09G1/02 |
主分类号 |
H01L21/3105 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polishing composition comprising:
silica having an organic acid immobilized on a surface thereof; a dihydric alcohol having a molecular weight of less than 20,000; and a pH adjusting agent, the polishing composition having a pH of 6 or less. |
| 地址 |
Kiyosu-shi JP |
