| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make simple polishing by using a low cost and low accuracy polishing unit even if a polishing step is needed when a semiconductor device called, for example, a "BGA", is manufactured. <P>SOLUTION: Semiconductor constituents 3 each called "CSP" are disposed at a plurality of predetermined positions on an adhesion layer 2 on a base plate 1 having a size corresponding to a plurality of the semiconductor devices. Then, an insulator material 13A made of a semicured thermosetting resin containing a glass fiber, etc. is disposed between the semiconductor constituents 3, heated and pressurized by using a pair of heating and pressurizing plates, thereby forming an insulator made substantially in plane with the upper surface of the conductor constituents 3 on the upper surface. In this case, even if the resin in the insulator material 13A flows out on the semiconductor constituents 3, this resin is simply removed by polishing by using a low cost and low accuracy buff or endless polishing belt. When an upper layer insulating film, an upper layer rewiring, a solder ball, etc. are formed on the resin and are then cut between the adjacent semiconductor constituents 3, a plurality of the semiconductor devices each having the solder ball are obtained. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
