MULTILAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a multilayer circuit board and a method of manufacturing the same circuit board in which manufacturing cost can be reduced, reliability in the electrical continuity among multilayers can be attained, and a degree of freedom for design of printed circuit board can be improved.

SOLUTION: The multilayer printed circuit board formed by stacking a plurality of printed circuit boards comprises bonding layers formed of an insulating bonding material which is provided among the printed circuit boards to mutually bond these printed circuit boards, missing portions provided to the bonding layers corresponding to the areas required to become conductive among the pads of the printed circuit boards, and conductive layers formed of conductive bonding material provided at the surface of at least one pad of the pads at the areas required to become conductive for attaining electrical continuity among the pads in the areas required to become conductive when formed through the thermal pressing processes.

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