SUBSTRATE PROCESSING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing device which is capable of effectively removing surface roughness in the periphery of a substrate or a film which adheres to the periphery or the like of the substrate to become a pollution source in a process of manufacturing a semiconductor device. SOLUTION: The substrate processing device performs a process of pressing a polishing tape 21 on the prescribed spot of the substrate W and polishing the substrate W by sliding the tape 21 on the substrate W. The substrate processing device is equipped with a polishing unit 10 which is provided with an edge polishing unit 20 that polishes the edge E of the substrate W pressing the polishing tape 21 against the edge E, and a beveled part polishing unit 40 that polishes the beveled part B of the substrate W pressing the polishing tape 21 against the beveled part B. COPYRIGHT: (C)2004,JPO&NCIPI