发明名称 |
Self-aligning wafer burn-in probe |
摘要 |
The material and geometric properties of an electrical probe contact are combined to produce an electrical contact which is capable of self-alignment over many thousands of uses. The probe contact moves substantially only in a vertical direction and provides a consistent contact force with corresponding electrical contact pads on a semiconductor wafer. The probe contacts are configured in an array of a large plurality of individual contacts which extend from a base to which they are attached through apertures in an overlying mask spaced apart from the base.
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申请公布号 |
US6788085(B2) |
申请公布日期 |
2004.09.07 |
申请号 |
US20010902964 |
申请日期 |
2001.07.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
NOTOHARDJONO BUDY D.;SCHMIDT ROGER R. |
分类号 |
G01R1/067;G01R1/073;G01R31/28;H01L21/66;(IPC1-7):G01R31/02 |
主分类号 |
G01R1/067 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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