发明名称 CHAMBER ASSEMBLY FOR FABRICATING SEMICONDUCTOR DEVICE TO IMPROVE COUPLING STRUCTURE BETWEEN BODY AND COVER
摘要 PURPOSE: A chamber assembly for fabricating a semiconductor device is provided to prevent damage of a body and a cover for covering an open part of the body by improving a coupling structure between the body and the cover. CONSTITUTION: A body(22) includes an open upper part and is formed with a shape of a container. A cover(26) is used for covering the open upper part of the body. A plurality of guide grooves(28) are formed on an upper part of the body. A lower part of a guide(30) is inserted into the guide grooves. An upper part of the guide penetrates the cover. A handle is coupled to an upper end of the guide projected from the upper part of the cover.
申请公布号 KR20040080016(A) 申请公布日期 2004.09.18
申请号 KR20030014850 申请日期 2003.03.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, JAE UK
分类号 H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项
地址