发明名称 |
CHAMBER ASSEMBLY FOR FABRICATING SEMICONDUCTOR DEVICE TO IMPROVE COUPLING STRUCTURE BETWEEN BODY AND COVER |
摘要 |
PURPOSE: A chamber assembly for fabricating a semiconductor device is provided to prevent damage of a body and a cover for covering an open part of the body by improving a coupling structure between the body and the cover. CONSTITUTION: A body(22) includes an open upper part and is formed with a shape of a container. A cover(26) is used for covering the open upper part of the body. A plurality of guide grooves(28) are formed on an upper part of the body. A lower part of a guide(30) is inserted into the guide grooves. An upper part of the guide penetrates the cover. A handle is coupled to an upper end of the guide projected from the upper part of the cover.
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申请公布号 |
KR20040080016(A) |
申请公布日期 |
2004.09.18 |
申请号 |
KR20030014850 |
申请日期 |
2003.03.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNG, JAE UK |
分类号 |
H01L21/02;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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