| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board which has less residual stress caused by a thermal history in a high temperature, is superior in interlayer connection reliability, has resistivity against warping, has high productivity, and can deal with the high density of wiring. <P>SOLUTION: In the multilayer wiring board, a plurality of films having conductor layers are laminated through adhesion layers. Storage modulus at 125°C in the adhesion layer is set to be not more than 5.0×10<SP>7</SP>Pa. It is more desirable that storage modulus at 150°C in the adhesion layer is set to be not more than 1.0×10<SP>7</SP>Pa. The adhesion layer whose storage modulus in the high temperature is introduced into a multilayer wiring board structure. Thus, stress caused by the thermal history in the high temperature can effectively be relieved. Consequently, residual stress can be reduced, and the multilayer wiring board which is superior in interlayer connection reliability, in resistivity against warping and conductivity, and can deal with the high density of wiring can be provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
