发明名称 COMMUNICATION DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a communication device package capable of ensuring hermeticity inside the package. <P>SOLUTION: The communication device package is comprised of a base member 11 made of a resin material and formed into a box shape, conductive electrodes 15 made of a metal material and fixed from the inside to the outside of the base member 11, a frame member 12 made of a metal material and fixed on the base member 11, and a cover member 13 welded on the frame member 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004335638(A) 申请公布日期 2004.11.25
申请号 JP20030127887 申请日期 2003.05.06
申请人 SEIKO INSTRUMENTS INC 发明人 ITO HIRONOBU;MAKISHIMA YUTAKA;ONODERA HIDEHARU
分类号 H01L23/04;H01L23/08;H03H3/02;H03H9/02;(IPC1-7):H01L23/04 主分类号 H01L23/04
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