发明名称 Optimization of die placement on wafers
摘要 A method of optimizing production of semiconductor devices on a wafer comprises steps of characterizing at least one effect of at least one manufacturing component on at least one optimization criterion; inputting user optimization data; and, based on the at least one effect and the user optimization data, performing optimization to determine a layout of semiconductor devices on the wafer that optimizes performance according to the user optimization data.
申请公布号 US6826738(B2) 申请公布日期 2004.11.30
申请号 US20030428747 申请日期 2003.05.02
申请人 PDF SOLUTIONS, INC. 发明人 CADOURI EITAN
分类号 G03F7/20;H01L21/66;(IPC1-7):G06F17/50;G06F19/00 主分类号 G03F7/20
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