发明名称 ARTICLE COMPRISING SILICON SUBSTRATE AND BOND LAYER
摘要 PROBLEM TO BE SOLVED: To provide a bond coat which does not badly influence the mechanical properties of a silicon substrate. SOLUTION: The bond coat (14') of a silicon substrate (12) contains a first phase (30) and a second phase (40). The first phase (30) is selected from the group consisting of high-melting-point metal oxides, high-melting-point metal silicates, and their mixtures. The second phase (40) is selected from the group consisting of metals forming high-melting-point metal oxides, SiC, Si<SB>3</SB>N<SB>4</SB>, and their mixtures. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004345944(A) 申请公布日期 2004.12.09
申请号 JP20040148492 申请日期 2004.05.19
申请人 UNITED TECHNOL CORP <UTC> 发明人 EATON HARRY E;NAIR SHANTIKUMAR V;SUN ELLEN Y;BHATIA TANIA
分类号 C04B41/90;C04B41/50;C04B41/87;C23C28/04;C23C30/00;F01D5/28;(IPC1-7):C04B41/90 主分类号 C04B41/90
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