| 摘要 |
PROBLEM TO BE SOLVED: To provide a sticking device which automatically sticks a dicing-die bond tape consisting of a die bond tape that has been formed to have a shape of a substrate and a wide dicing tape onto a substrate without damaging the thin substrate. SOLUTION: The device for sticking the dicing-die bond tape 1 onto the substrate consists of an adsorption and heating table 36 for fixing the substrate (wafer 5), a die bond tape sticking roller 34 for crimping a portion of the die bond tape 3 toward the substrate, a support table 19 for supporting the substrate stuck to the die bond tape 3, a mounting table 40 for fixing a dicing frame 6, a dicing tape sticking roller 35 for crimping the dicing tape 2 onto the dicing frame 6, and a cutter blade 62 for cutting the dicing tape 2 along the dicing frame 6 with circular movement. The device enables automatic sticking of the dicing-die bond tape in which the die bond tape having the shape of the wafer (substrate) is sandwiched between a cover film and the dicing tape, whereby the die bond tape no longer has to be cut on the wafer to prevent damages on the wafer, costs of the tape can be reduced since the die bond tape is used only at the wafer, the number of sticking steps can be reduced to improve the efficiency of producing such products as multistage stacked packages which require treatment of a large number of substrates. COPYRIGHT: (C)2005,JPO&NCIPI |
