发明名称 COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling device with a simple structure, which can be miniaturized and thinned while improving the cooling efficiency. SOLUTION: This cooling device is provided in a closed circulating passage for circulating a refrigerant, and adapted so that a centrifugal pump 1 makes contact with a heating electronic part 2 to take heat from the electronic part 2 by the heat exchange effect of the refrigerant therein by the contact, and the heat is released from a radiator. The centrifugal pump 1 comprises a pump casing 15 and an open type impeller 11. The pump casing 15 has a pump chamber recessed part, a number of projections 24 protruded from the bottom thereof, a heat receiving surface 15b formed on a side surface laid along an internal pump chamber 15a. The heat receiving surface 15b is formed in a complementary shape with the three-dimensional shape of the upper surface of the heating electronic part 1 in the contact position therewith, and a suction passage 19 is provided between the heat receiving surface 15b and the inner wall surface of the pump chamber 15a. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004347291(A) 申请公布日期 2004.12.09
申请号 JP20030147260 申请日期 2003.05.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KOGA SHINYA;SAKAI TOSHISUKE;NIWATSUKINO YASUSHI;KUBOTA TOSHIYUKI
分类号 F04D13/00;F04D29/42;F25D9/00;F25D17/02;H01L23/473;(IPC1-7):F25D17/02 主分类号 F04D13/00
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