Package-on-package structure with reduced height

摘要

To achieve a package-on-package having an advantageously reduced height, a first package substrate has a window sized to receive a second package die. The first package substrate interconnects to the second package substrate through a plurality of package-to-package interconnects such that the first and second substrates are separated by a gap. The second package die has a thickness greater than the gap such that the second package die is at least partially disposed within the first package substrate's window.

主权项

1. A device, comprising:
a first package substrate having a window extending entirely through the first package substrate; a first package die; a plurality of first interconnects in direct contact with both the first package substrate and the first package die, wherein the plurality of first interconnects is configured to provide a first electrical connection for a first signal between the first package die and the first package substrate; a second package substrate interconnected to the first package substrate through a plurality of package-to-package interconnects, the first package substrate comprising a first surface facing the second package substrate and a second surface facing away from the second package substrate; a second package die; a plurality of second interconnects in direct contact with both the second package substrate and the second package die, wherein the plurality of second interconnects is configured to provide a direct second electrical connection for a second signal between the second package die and the second package substrate, and wherein the second package die is disposed at least partially within the window; and a mold compound configured to encapsulate the second package die and to have a surface aligned in a plane with the second surface of the first package substrate, wherein the mold compound is further configured to encapsulate the package-to-package interconnects.