PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent resolution.SOLUTION: The photosensitive resin composition is to be used in a method of manufacturing a semiconductor component including: a step of forming a photosensitive layer on a substrate by using a photosensitive resin composition; a step of irradiating a predetermined portion of the photosensitive layer to expose the predetermined portion and then heating the photosensitive layer after exposure; and a development step of removing a portion of the photosensitive layer other than the predetermined portion so as to form a resist pattern comprising a cured product of the photosensitive resin composition on the substrate. The photosensitive resin composition comprises the following components of: (A) a resin having a phenolic hydroxyl group; (B) an aliphatic or alicyclic epoxy compound having two or more oxirane rings; and (C) a photosensitive acid generator. The photosensitive resin composition has a content of a sensitizer of 1 part by mass or less with respect to 100 parts by mass of (A) component.SELECTED DRAWING: None