THIN FILM PROCESSING APPARATUS AND PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a thin film processing apparatus capable of adjusting the intensity of a laser beam in matching with the film thickness of a part of a film from which the film part is removed.

SOLUTION: The thin film processing apparatus includes: a film thickness measurement section for measuring the thickness of a film (13) formed on a substrate (10); a laser (1) for outputting the laser beam (50) for removing part of the film (13); and laser adjustment sections (2, 7) for adjusting the intensity of the laser beam (50) on the basis of the thickness of the film (13) measured by the film thickness measurement section. The film thickness measurement section includes: an irradiation section (5) for irradiating the film with an electromagnetic wave; and a measurement section (6) for measuring the electromagnetic wave transmitted through the film (13). The film thickness measurement section measures the film thickness of the part of the film to be removed and can properly adjust the intensity of the laser beam (50).

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