| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a double wavelength semiconductor laser apparatus for preventing inter-terminal short circuit owing to a solder flow upon mounting a semiconductor laser element on a heat sink with soldering, and for improving mounting efficiency. <P>SOLUTION: A semiconductor laser chip LDC of the double wavelength semiconductor laser apparatus 10 includes a junction-down structure obtained by making junction layers 14, 18 as a light emitting part approach the heat sink 23 and fixing the junction layers. A first electrode 24 is provided on the heat sink fixing surface of the lower part of a semiconductor laser element LD1 on a short wavelength side between two semiconductor laser elements emitting the different wavelengths via a solder layer 26, such that it makes contact with the entire surface of one electrode 21 of the semiconductor laser element on the short wavelength side. A second electrode is provided on the heatsink fixing surface of the lower part of a semiconductor laser element LD2 on a long wavelength side via a solder layer, such that it makes partial contact with a part thereof excepting the lower part 30 of a waveguide as the light emitting part 19 of one electrode 22 of the semiconductor laser element on the long wavelength side. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
