INTERPOSER SUBSTRATE WITH SEMICONDUCTOR ELEMENT, SUBSTRATE WITH INTERPOSER SUBSTRATE, AND STRUCTURE CONSISTING OF SEMICONDUCTOR ELEMENT, INTERPOSER SUBSTRATE AND SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a structure consisting of a semiconductor element, an interposer substrate and a substrate which can be produced relatively easily and exhibiting excellent connection reliability.

SOLUTION: The inventive structure 11 consists of a semiconductor element 15, an interposer substrate 21 and a substrate 41. The semiconductor element 15 is mounted on the first surface 32 of an interposer substrate body 38 having a second surface 33 being mounted on the surface of the substrate 41. A plurality of first surface side terminals 28 are arranged on the first surface 22 side of the interposer substrate body 38 and a plurality of second surface side terminals 29 are arranged on the second surface 23 side. The first surface side terminals 28 and the second surface side terminals 29 are conducting through conduction structures 30, 31 and 32. At least any one of dummy terminals 91 and 92 and a dummy conductor post 100 not connected with the surface connection terminal 16 of the semiconductor element 15 is formed in the interposer substrate body 38.

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