发明名称 Process for reducing the passive layer from the surface of a metal
摘要 The present invention is directed to a process for reducing the passive layer on a metal. The process includes reacting a treatment composition having a non-metallic compound with metal ions in the passive layer of a metal, thereby forming an organometallic complex precipitate, and removing the organometallic complex precipitate. In one embodiment the non-metallic compound is a thiuram. In another embodiment, the treatment composition further includes a non-metallic compound that is a dithiocarbamate.
申请公布号 US6855259(B2) 申请公布日期 2005.02.15
申请号 US20020211471 申请日期 2002.08.01
申请人 发明人
分类号 G03C5/00;C02F1/00;C02F1/28;C02F1/42;C02F1/52;C02F1/62;C02F1/64;C02F1/66;C02F1/68;C08J3/00;C09K3/00;C11D1/00;C22B3/02;C22B3/46;C23G1/00;(IPC1-7):C02F1/42 主分类号 G03C5/00
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