发明名称 WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board that improves long-term reliability to surely and strongly maintain electrical connection for a long time by preventing the interface of an electrode and a solder on the wiring board from being released by stress. <P>SOLUTION: A multi-layered wiring board having an electrode to be connected with a solder has an electrode structure wherein the outer periphery of the electrode rises along with a wall surface of a solder resist 5. A single-side wiring board that has an electrode to be connected with a solder and uses an insulating tape as a support, includes an electrode structure wherein the outer periphery of the electrode rises along a wall surface of the insulating tape. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005079420(A) 申请公布日期 2005.03.24
申请号 JP20030309654 申请日期 2003.09.02
申请人 TOPPAN PRINTING CO LTD 发明人 NAKAMURA KIYOTOMO
分类号 H05K3/34;H05K3/46;(IPC1-7):H05K3/34 主分类号 H05K3/34
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