| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively provide a small power module of high density. SOLUTION: The power module is provided with a metal substrate 1 having a plurality of power semiconductor elements 12 mounted on a metal base substrate 11, a wiring circuit where electrodes are wired, and an electrode where a part of it is exposed; and a control substrate 2 having a circuit board 21 where a control circuit component 23 controlling a power semiconductor element is mounted on one face, an electrode of the control circuit component is wired on the other face, and an electrode part where a part of it is exposed. The electrode of the metal substrate 1 is connected with the electrode of the control substrate 2. A connection substrate 3 having a conduction 32 conducting the electrodes and component storage holes 33 mounting the power semiconductor elements is arranged between the metal substrate and the control substrate. COPYRIGHT: (C)2005,JPO&NCIPI |
