| 摘要 |
PROBLEM TO BE SOLVED: To secure the plane property of a disk substrate which is molded/manufactured through a peeling process while attaining the shortening of a molding cycle. SOLUTION: A mold device for molding a substrate has a resistance mold release part 15 formed by doing roughening in relation to the inner surface of a mold in the shape of a surface by point collection, line collection, or the combination of them on the inner surface of the mold corresponding to the peripheral side end surface of the disk substrate 4. When the disk substrate 4 molded by packing a synthetic resin material in a substrate molding cavity 5 fitted with a stamper 7 for transfer is stripped from the stamper 7, by showing " resistance" to the peripheral side end surface of the disk substrate 4 by the resistance mold release part 15, the stripping from the stamper 7 can be done with the plane property maintained. After that, when the disk substrate 4 is stripped from the mold 2, by showing "a mold release property" to the peripheral side end surface of the disk substrate 4 by the resistance mold release part 15, even when the molding cycle is short, the stripping of the disk substrate can be done with the plane property maintained. COPYRIGHT: (C)2005,JPO&NCIPI |
