Flexible sensor package responsive to thermally induced distortion

摘要

A sensor package P is a surface-mounted sensor package which is adapted to be mounted on a printed board 200 . The sensor package P includes a case 1 for accommodating a semiconductor acceleration sensor chip 100 having output pads 101 . The case has a bottom wall 10 , which is divided into a center area 10 a for supporting the sensor chip 100 and a peripheral area 10 b. Output electrodes 15 to be connected to the output pads 101 are formed on external surfaces of the peripheral area. These output electrodes 15 are soldered to the printed board 200 for electrical connection between the sensor chip and an electric circuit of the printed board as well as for holding the sensor package physically on the printed board. The feature of the present invention resides in that grooves 12 are formed in an interior surface of the bottom wall 10 between the center area 10 a and the peripheral area 10 b.