发明名称 |
Method of supplying slurry and a slurry supply apparatus having a mixing unit at a point of use |
摘要 |
A computer-controlled slurry supplying apparatus for providing abrasive slurry to a chemical mechanical polishing (CMP) machine in a semiconductor manufacturing process preferably comprises a storage portion for accepting and storing a quantity of undiluted slurry, a mixing portion for accepting undiluted slurry from the storage portion and mixing with a diluting solution to created a diluted slurry, a supply portion for holding the diluted slurry, and at least one point-of-use mixing unit for mixing at least one chemical additive to the diluted slurry at or near a dispensing nozzle at the point of application. Each of the above portions of the slurry supplying apparatus further includes a re-circulation means for keep solutions in a mixed and agitated state. A method for using the slurry supplying apparatus comprises steps of controllably operating various valves, pumps, and sensors to maintain a desired slurry composition and flow rate. |
申请公布号 |
US6910954(B2) |
申请公布日期 |
2005.06.28 |
申请号 |
US20020145806 |
申请日期 |
2002.05.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM SUE-RYEON;KIM SEUNG-UN;CHAE SEUNG-KI;LEE JE-GU;AHN SEUNG-HOON |
分类号 |
B01F3/12;B01F15/00;B24B37/00;B24B57/02;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B01F3/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|