| 摘要 |
Embodiments disclosed in the detailed description include a complete system-on-chip (SOC) solution using monolithic three dimensional (3D) integrated circuit (IC) (3DIC) integration technology. The present disclosure includes example of the ability to customize layers within a monolithic 3DIC and the accompanying short interconnections possible between tiers through monolithic intertier vias (MIV) to create a system on a chip. In particular, different tiers of the 3DIC are constructed to support different functionality and comply with differing design criteria. Thus, the 3DIC can have an analog layer, layers with higher voltage threshold, layers with lower leakage current, layers of different material to implement components that need different base materials and the like. Unlike the stacked dies, the upper layers may be the same size as the lower layers because no external wiring connections are required. |
| 主权项 |
1. A monolithic three dimensional (3D) integrated circuit (IC) (3DIC) system, comprising:
a plurality of tiers positioned one on top of another; a plurality of functional elements selected from the group consisting of:
computation, digital processing, analog processing, radio frequency (RF) signal processing, analog/mixed signal processing, power management, sensor, power supply, battery, memory, digital logic, low leakage, low noise/high gain, clock, combinatorial logic, and sequential logic; the plurality of functional elements distributed amongst the plurality of tiers; and a plurality of monolithic intertier vias (MIV) electrically coupling the plurality of tiers; the plurality of functional elements providing a self-contained system on a chip (SOC). |
