RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a resin composition and a resin film that can facilitate a molding process, and can be suitably used for a wafer level package.SOLUTION: The resin composition comprises the following components: (A) a silicone resin having a structural unit of formula (1); (B) a phenolic compound; and (C) a filler [R-Rare a monovalent hydrocarbon group; where, both of Rand Rcannot be a methyl group at the same time; m and n are an integer of 0-300; R-Rare a divalent hydrocarbon group; both of a and b are a positive number to satisfy the relationship of a+b=1; and X is a divalent organic group comprising an epoxy group].SELECTED DRAWING: None