摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin curing method and a thermosetting resin curing device capable of satisfactorily curing a thermosetting resin agent by the irradiation of laser light.SOLUTION: Provided is a thermosetting resin curing method curing a thermosetting resin 13 by the irradiation of laser light L. The laser light L has a wavelength longer than that in the wavelength region at which the light absorption rate of the thermosetting resin 13 reaches the maximum or a wavelength shorter than that in the wavelength region, and is made incident from the surface part 13s to the inside 13i so as to be made convergent from the surface part 13s of the thermosetting resin 13 to the inside 13i of the thermosetting resin 13.SELECTED DRAWING: Figure 6 |