发明名称 THERMOSETTING RESIN CURING METHOD AND THERMOSETTING RESIN CURING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin curing method and a thermosetting resin curing device capable of satisfactorily curing a thermosetting resin agent by the irradiation of laser light.SOLUTION: Provided is a thermosetting resin curing method curing a thermosetting resin 13 by the irradiation of laser light L. The laser light L has a wavelength longer than that in the wavelength region at which the light absorption rate of the thermosetting resin 13 reaches the maximum or a wavelength shorter than that in the wavelength region, and is made incident from the surface part 13s to the inside 13i so as to be made convergent from the surface part 13s of the thermosetting resin 13 to the inside 13i of the thermosetting resin 13.SELECTED DRAWING: Figure 6
申请公布号 JP2016203640(A) 申请公布日期 2016.12.08
申请号 JP20160146523 申请日期 2016.07.26
申请人 HAMAMATSU PHOTONICS KK 发明人 OMIYA TAKENORI;OISHI SATOSHI
分类号 B29C65/48;B29C35/08 主分类号 B29C65/48
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