| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solid-state imaging device in which the light-receiving section is protected by a transparent cover by loading either the transparent cover or the solid-state imaging-device chip on an adhesive part, which consists of an adhesive and is arranged on the other of the solid-state imaging-device chip or the transparent cover, to integrate them so as to enclose the light-receiving section of the solid-state imaging-device chip with the transparent cover, to consequently tightly enclose the light-receiving section quite easily while ensuring a predetermined space between the light-receiving section and the transparent cover. <P>SOLUTION: The solid-state imaging device comprises a solid-state imaging-device chip 11 having a fixed space on the circumference of the light-receiving section 12, a transparent cover 13 which covers the light-incident side of the light-receiving section 12, and an adhesive part arranged so as to enclose the circumference of the light-receiving section and consisting of an adhesive for bonding the solid-state imaging-device chip 11 and the transparent cover 13. A predetermined space is ensured between the light-receiving section 12 and the transparent cover 13 by the adhesive part to tightly enclose the light-receiving section. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
