发明名称 CIRCUIT MODULE
摘要 <p><P>PROBLEM TO BE SOLVED: To miniaturize a circuit module provided with a pressure sensitive element. <P>SOLUTION: The thickness and the space of a laminated sheet where the pressure sensitive element and a circuit element are connected electrically are reduced to reduce the thickness of the whole circuit module. In addition, noise due to influence of electromagnetic wave, an electric field, etc. is cut off by using a reinforcing plate. Thus, pressure information can be converted to a precise electric signal. In addition, noise from the circuit module to outside is cut off. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005268404(A) 申请公布日期 2005.09.29
申请号 JP20040076299 申请日期 2004.03.17
申请人 SANYO ELECTRIC CO LTD 发明人 MAEHARA EIJU;KOBAYASHI KENICHI
分类号 G06F3/033;G01L9/02;H01L23/48;H01R13/62;H05K1/00;H05K1/02;H05K1/11;H05K1/18;H05K3/00;H05K3/46;(IPC1-7):H05K1/02 主分类号 G06F3/033
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