| 发明名称 |
Semiconductor device with decoupling capacitors mounted on conductors |
| 摘要 |
A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface, metal foil leads 5 electrically connected to each of the pads and adhered to the LSI device via an insulation layer, and decoupling capacitors mounted on one surface of the metal foil leads.
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| 申请公布号 |
US6949815(B2) |
申请公布日期 |
2005.09.27 |
| 申请号 |
US20030746603 |
申请日期 |
2003.12.23 |
| 申请人 |
NEC CORPORATION |
发明人 |
YAMAZAKI TAKAO;MORI TORU;SHIBUYA AKINOBU;YAMAMICHI SHINTARO;SHIMADA YUZO |
| 分类号 |
H05K3/34;H01L21/60;H01L21/822;H01L23/12;H01L23/50;H01L23/64;H01L27/04;(IPC1-7):H01L23/52;H01L23/48;H01L23/32;H01G9/05 |
主分类号 |
H05K3/34 |
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