发明名称 LGA PACKAGE SOCKET
摘要 A compact land grid array (LGA) package socket (1) comprising a housing (2) which has multiple cavities containing contacts for electrical engagement with contacts of the LGA package (200). The housing (2) is sandwiched between a metal reinforcing plate (10) and a metal cover (8) which is hingeably connected to shafts (26) at a first end of the housing. A lever (12) is hinged to an opposite second end of the housing (2) and has a cranked locking portion (15) which holds the cover (8) in a closed position by means of a locking element (74) thereon when the lever (12) is moved into engagement with a protrusion (14) on the housing (2). The cover (8) has convex surfaces for bearing on the LGA package (200). Clamping the housing between the metal cover (8) and the metal reinforcing plate (10) reduces the likelihood of the housing (2) deforming. LGA package (200) installation is simplified. <IMAGE>
申请公布号 SG115576(A1) 申请公布日期 2005.10.28
申请号 SG20030006245 申请日期 2003.10.16
申请人 TYCO ELECTRONICS AMP K.K. 发明人 HIROSHI SHIRAI;MASASHI INOUE;SHINICHI HASHIMOTO
分类号 H01R33/76;H01L23/32;H01L23/40;H05K7/10;(IPC1-7):H05K7/02 主分类号 H01R33/76
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