Manufacturing apparatus and manufacturing method of semiconductor device

摘要

A load lock chamber ( 12 ) is connected in a front stage of a film forming chamber ( 11 ) through a damper and the like. A pipe to which a N₂ gas and aeriform or fog-like H₂O are supplied is connected to the load lock chamber ( 12 ). The pipe is led from a vaporizer ( 13 ). Inside the load lock chamber ( 12 ), a carrying section 15 on which a wafer ( 20 ) is placed is provided, whereas outside the load lock chamber ( 12 ), a cooler ( 14 ) cooling a carrying section ( 15 ) by means of liquid nitrogen is arranged. The temperature of the carrying section 15 is held at, for example, -4° C.