| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of peeling a positive resist film which requires no special management prescribed by the Fire Service Law and various environmental laws, enables processing with low cost, and requires no large-scale processing apparatus for a large substrate. <P>SOLUTION: A substrate has a positive resist film, and the surface of the resist film is exposed and developed to form a resist pattern. After a thin film is etched with the resist pattern serving as a mask, the resist film is entirely irradiated with exposure light and brought into contact with developer, so that the patterned resist film is peeled off. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
