| 摘要 |
PROBLEM TO BE SOLVED: To provide a method, which prepares a dome-shaped contact on a printed circuit board, includes a process which etches a center hole on each copper pad and screens a rising silver epoxy resin in its opening. SOLUTION: The silver epoxy resin on the pad loses its shape, forming a dome-shaped bump. The silver epoxy rein is then cured, and a gold plated contact, where a layer of an electroless nickel and a layer of gold are covered on it in order, is of a united structure and acts to make a connection to a mezzanine substrate easily. COPYRIGHT: (C)2006,JPO&NCIPI |
