| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin composition comprising a polyimide silicone-based resin composition which gives high adhesion to base materials having various shapes and does not require a removing process of a solvent, after coating or other operations, and having such a structure that discoloration of the polyimide silicone resin does not disturb light absorption of a phoytopolymerization initiator. SOLUTION: This resin composition of non-solvent type contains at least (a) a polyimide silicone resin, (b) a reactive diluent, and (c) the photopolymerization initiator, wherein the polyimide silicone resin (a) has repeating units expressed by general formula (1-1) (X is a tetravalent organic group; and Y is a bivalent organic group) and general formula (1-2) (Z is a bivalent organic group having an organosiloxane part) and has a light transmittance of≥80% which is measured at a wavelength of 350 nm to 450 nm after the composition is formed into a film having a thickness of 100μm on a quartz glass base plate. COPYRIGHT: (C)2006,JPO&NCIPI |
