| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame with heat releasing members which is excellent in workability and productivity for making it possible to use an easily available thin plate member, and to adjust the thickness of the whole heat releasing member. SOLUTION: This lead frame 13 is configured to be used for, for example, a semiconductor device such as a power MOSFET, and provided with a heat releasing member 12. The heat releasing member 12 is configured by carrying out the caulking lamination of a plurality of thin plate materials 18 to 20, and fixed to a lead frame main body 23. COPYRIGHT: (C)2006,JPO&NCIPI |
