| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an attaching structure of an electronic element to a substrate which can restrain the inflow of solder into a through hole which should be protruded from the prescribed edge of a heat dissipating plate when the heat dissipating plate is soldered to a land. <P>SOLUTION: At a part between the heat dissipating plate 11 of the electronic element 12 and the land 17 formed on the surface 13a of the substrate 13, a partition 21 is arranged which is used for restraining the inflow of the solder 19 into the through holes 18 which are formed in the land 17 and the substrate 13 which should be protruded from the prescribed edge 11b of the heat dissipating plate 11 when the heat dissipating plate 11 is soldered to the land. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
