| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board not having a core board capable of reducing a crack generated at the connection part of a solder ball or the like used for connection with the other board. <P>SOLUTION: The wiring board does not have the core board, and mainly takes a wiring laminate where a dielectric layer composed of a high polymer material and a conductive layer are laminated alternately with a solder resist layer formed on at least one principal surface of the wiring laminate. The principal surface on a side to which a semiconductor component is mounted is assumed to be an upper side principal surface and the principal surface on a side where it is connected to the other board is assumed to be a lower side principal surface. The dielectric layer of a lowermost layer among the dielectric layers constituting the wiring laminate has a Young's modulus lower than the other dielectric layer, and includes a low Young's modulus layered region having a Young's modulus of≥0.01 GPa and≤0.6 GPa. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
