| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a design system for a semiconductor device which permits the evaluation of finally expected cost at the initial stage of the design of a three-dimensional mounting circuit. <P>SOLUTION: The design system is provided with an arrangement connection information storage means 2 for storing arrangement data, die shape data, terminal data and connection data of each die, a wiring rule storage means 7, a cost calculating formula storage means 10 for storing a cost calculating formula by cost calculation parameters including the height of a stacked die, a step count, a plane view area and a necessary substrate area, a three-dimensional information calculation means 3 for calculating the height of the die, a lamination layer stage count and a plane view area, a wiring terminal coordinate calculating means 5, a virtual wiring means 8 which performs virtual wiring among respective wiring terminals designated by the connection data and calculates a substrate area necessary for the virtual wiring, and a cost calculating means 11 which uses the cost calculation parameters to calculate cost by the cost calculating formula. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
