发明名称 Method of manufacturing lateral MOSFET structure of an integrated circuit having separated device regions
摘要 Apparatus and Methods for the self-alignment of separated regions in a lateral MOSFET of an integrate circuit. In one embodiment, a method comprising, forming a relatively thin dielectric layer on a surface of a substrate. Forming a first region of relatively thick material having a predetermined lateral length on the surface of the substrate adjacent the relatively thin dielectric layer. Implanting dopants to form a top gate using a first edge of the first region as a mask to define a first edge of the top gate. Implanting dopants to form a drain contact using a second edge of the first region as a mask to define a first edge of the drain contact, wherein the distance between the top gate and drain contact is defined by the lateral length of the first region.
申请公布号 US6974753(B2) 申请公布日期 2005.12.13
申请号 US20040950273 申请日期 2004.09.24
申请人 发明人
分类号 H01L21/336;H01L29/06;H01L29/78;(IPC1-7):H01L21/336 主分类号 H01L21/336
代理机构 代理人
主权项
地址