| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the thickness of an optical device by employing a different structure from the resin molded structure to miniaturize an apparatus with the optical device mounted therein. <P>SOLUTION: The optical device comprises a copper plate 10 with openings 10b, a flexible board 13 disposed below the copper plate 10, a light receiving element board 11 mounted on the wiring pattern of the flexible board 13 through bumps 25 below the copper plate 10, a light emitting element 12 and a light receiving element 15 provided on the main surface of the light receiving element board 11, and a support frame 14 for supporting the flexibly bending board 13. The support frame 14 fixes the flexible board 13 to the copper plate 10, thus achieving a thin optical device without employing the resin molded structure. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
