| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer substrate capable of being deformed by a temperature change in an external environment whereby the separation of BGA (Ball Grid Array) or solder is not caused therein, and to provide an electric circuit device employing the interposer substrate. SOLUTION: The interposer substrate 1 is provided with a square insulating plate 2 composed of insulating resin having a square through hole 2a formed at the central part thereof, and a crosspiece section 2b arranged so as to surround the outer periphery of the through hole 2a while first and second lands 3, 4 conducted with each other by a connecting conduit 5 are provided on both upper and lower surfaces of the crosspiece section 2b. Even though their expansion and contraction caused by a temperature change in the external environment are different when the insulating plate is connected to a circuit substrate 7 made of a different material or a mother substrate 14, the crosspiece section 2b is easily deformed by the existence of the through hole 2a, whereby the separation of BGA or solder can be eliminated. COPYRIGHT: (C)2006,JPO&NCIPI
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