发明名称 |
Chip-scale package |
摘要 |
A substrate having upper and lower surfaces, the upper surface including a periphery defined by first and second spaced apart side edges and front and rear spaced apart edges; a power semiconductor die disposed on the upper surface of the substrate, the die including a top surface on which at least a first metalized surface is disposed and a bottom surface; a plurality of conductive pads disposed only at the second side edge of the substrate; and a plurality of wire bonds extending from the first metalized surface to the plurality of conductive pads.
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申请公布号 |
US6984890(B2) |
申请公布日期 |
2006.01.10 |
申请号 |
US20040884521 |
申请日期 |
2004.07.02 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
SHIVKUMAR BHARAT;KINZER DANIEL M.;MUNOZ JORGE |
分类号 |
H01L23/12;H01L23/34;H01L21/60;H01L23/48;H01L23/498;H01L23/52;H01L23/528;H01L25/07;H01L25/18;H01L29/40 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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