| 摘要 |
PROBLEM TO BE SOLVED: To enable measurement of position of a mark on a wafer with high precision. SOLUTION: An exposure apparatus 1 is provided with a surface state inspection device 30 which has an imaging apparatus 22c for inspecting surface state of a wafer W held on a wafer holder 15. Imaging data D2 imaged by the imaging apparatus 22c are supplied to a main control system 20, and defective distribution on the wafer W is computed. Based on the defective distribution, the main control system 20 selects a mark for instrumentation from marks formed on the wafer W, and location information of the selected mark for instrumentation is measured by using an alignment detection system AS. COPYRIGHT: (C)2006,JPO&NCIPI |
