发明名称 |
Leadframe for use in a semiconductor package |
摘要 |
A leadframe comprises a die mounting area, a plurality of lead fingers and a metal deposit having a negative electrochemical potential with respect to a standard H<SUB>2 </SUB>half cell. A semiconductor package comprises the leadframe and a semiconductor chip having a plurality of contact areas mounted to the die mounting area and electrically connected to the inner ends of the lead fingers of the leadframe by a plurality of bond wires. The semiconductor chip, the bond wires and inner portions of the lead fingers are encapsulated by a plastic housing.
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申请公布号 |
US7432584(B2) |
申请公布日期 |
2008.10.07 |
申请号 |
US20040962433 |
申请日期 |
2004.10.13 |
申请人 |
INFINEON TECHNOLOGIES, AG |
发明人 |
GOH KOH HOO;KEONG BUN-HIN |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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