CONNECTION STRUCTURE, WIRING BOARD CONNECTOR, WIRING BOARD MODULE, AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a connection structure of narrow pitch and low profile, capable of coping with reduction in thickness and size.

SOLUTION: The connection structure includes a housing 20 in which a wired board is mounted, and an actuator which pressurizes a connected wiring board. The housing 20 includes an upper surface side first electrode 21a (upper surface side conductive layer) connected to a first wiring of the connected wiring board, and an upper surface side second electrode 21b (upper surface side conductive layer) connected to a second wiring of the connected wiring board. The upper surface side first electrode 21a and the upper surface side second electrode 21b are arranged in zigzag when viewed from above. The upper surface side first electrode 21a is connected to a lower surface side first electrode 22a by way of a through hole conductive layer 23, and the upper surface side second electrode 21b is connected to a lower surface side second electrode 22b by way of a side surface conductive layer 24. The lower surface side first and second electrodes 22a and 22b are respectively connected to wirings of a base board.

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