COLLETS FOR BONDING OF LIGHT EMITTING DIODES HAVING SHAPED SUBSTRATES

摘要

BONDING OF FLIP-CHIP MOUNTED LIGHT EMITTING DEVICES HAVING AN IRREGULAR CONFIGURATION IS PROVIDED. LIGHT EMITTING DIODES HAVING A SHAPED SUBSTRATE ARE BONDED TO A SUBMOUNT BY APPLYING FORCES TO THE SUBSTRATE AN A MANNER SUCH THAT SHEAR FORCES WITHIN THE SUBSTRATE DO NOT EXCEED A FAILURE THRESHOLD OF THE SUBSTRATE. BONDING A LIGHT EMITTING DIODE TO A SUBMOUNT MAY BE PROVIDED BY APPLYING FORCE TO A SURFACE OF A SUBSTRATE OF THE LIGHT EMITTING DIODE THAT IS OBLIQUE TO A DIRECTION OF MOTION OF THE LIGHT EMITTING DIODE TO THERMOSONICALLY BOND THE LIGHT EMITTING DIODE TO THE SUBMOUNT. COLLETS FOR USE IN BONDING SHAPED SUBSTRATES TO A SUBMOUNT AND SYSTEMS FOR BONDING SHAPED SUBSTRATES TO A SUBMOUNT ARE ALSO PROVIDED.