发明名称 Method for forming line end space structure using trimmed photo resist
摘要 One or more techniques or systems for forming a line end space structure are provided herein. In some embodiments, a first patterned second hard mask (HM) region is formed above a first HM region. Additionally, at least some of the first patterned second HM region is removed. In some embodiments, a first sacrificial HM region and a second sacrificial HM region are formed above at least one of the first patterned second HM region or the first HM region. Photo resist (PR) is patterned above the second sacrificial HM region, and a spacer region is deposited above the patterned PR and second sacrificial HM region. In some embodiments, at least some of at least one of the spacer region, the PR, or the respective sacrificial HMs is removed. In this way, a line end space structure associated with an end-to-end space is formed.
申请公布号 US9564327(B2) 申请公布日期 2017.02.07
申请号 US201514720875 申请日期 2015.05.25
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED 发明人 Lee Chia-Ying;Shieh Jyu-Horng;Shieh Ming-Feng;Chang Shih-Ming;Lai Chih-Ming;Hsieh Ken-Hsien;Liu Ru-Gun
分类号 H01L21/033;H01L21/02;H01L21/311;G03F7/00;H01L21/768;G03F7/16 主分类号 H01L21/033
代理机构 Cooper Legal Group, LLC 代理人 Cooper Legal Group, LLC
主权项 1. A method, comprising: patterning a hard mask (HM) region to form a patterned HM region above a base region; forming a trim photo resist (PR) region above the patterned HM region; forming a window within the trim PR region to expose a portion of the patterned HM region; and removing the portion of the patterned HM region exposed through the window.
地址 Hsin-Chu TW